发明名称 Gate electrode doping method for forming semiconductor integrated circuit microelectronic fabrication with varying effective gate dielectric layer thicknesses
摘要 Within a semiconductor fabrication and a method for fabricating the semiconductor fabrication there is provided a series of field effect devices having in a first instance an optional pair of different gate dielectric layer thicknesses, and in a second instance different dopant distribution profiles with respect to a pair of gate electrodes formed upon a pair of gate dielectric layers of a single thickness. The method provides the semiconductor fabrication with multiple gate dielectric layer thicknesses, actual and effective, with enhanced manufacturability and reliability.
申请公布号 US2003232473(A1) 申请公布日期 2003.12.18
申请号 US20020161837 申请日期 2002.06.04
申请人 TAIWN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 YEH LING-YEN;GUO JYH-CHYURN;CHEN IH-CHIN
分类号 H01L21/8234;(IPC1-7):H01L21/823;H01L29/792 主分类号 H01L21/8234
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