BONDING TOOL AND JOINING DEVICE FOR ELECTRONIC COMPONENT

摘要

A bonding tool has a vibration source for generating ultrasonic vibration, an ultrasonic horn to which the vibration source is connected at one end of the horn and capable of propagating ultrasonic vibration generated by the vibration source, and a vibration applying section connected to the ultrasonic horn and capable of applying vibration propagated through the ultrasonic horn to an electronic component. The ultrasonic horn is formed in an arch shape so that the horn has an arc section. The vibration applying section is connected to the arc section at the central position thereof. A tool installation section opposed to the vibration applying section is provided on the rear side of the arc section.