发明名称 Heterojunction semiconductor device and method of manufacturing
摘要 A semiconductor component (100) includes a semiconductor substrate (16) that is formed with trench (27). A semiconductor layer (20) is formed in the trench for coupling a control signal (VB) through a sidewall (25) of the trench to route a current (Ic) through a bottom surface (23) of the trench.
申请公布号 US6664574(B2) 申请公布日期 2003.12.16
申请号 US20010945683 申请日期 2001.09.05
申请人 SEMICONDUCTOR COMPONENTS INDUSTRIES LLC 发明人 AZAM MISBAHUL;LOECHELT GARY;COSTA JULIO
分类号 H01L21/331;H01L27/082;H01L29/737;(IPC1-7):H01L31/032;H01L31/117 主分类号 H01L21/331
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