发明名称 Photoexposure method for facilitating photoresist stripping
摘要 There is first provided a substrate 10 and a target layer 12. There is then formed upon the target layer a patterned positive photoresist layer 14. There is then processed the target layer while employing the patterned positive photoresist layer as a mask layer, to thus form a processed target layer and a processed patterned positive photoresist layer. There is then photoexposed 18 the processed patterned positive photoresist layer to enhance its solubility. Finally, there is then stripped from the processed target layer the photoexposed processed patterned positive photoresist layer while employing a solvent.
申请公布号 US6664194(B1) 申请公布日期 2003.12.16
申请号 US19990270588 申请日期 1999.03.18
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY 发明人 CHEN DIAN-HAU;PENG CHIANG-JEN;CHIU WEI-KAY
分类号 G03F7/42;H01L21/027;H01L21/311;(IPC1-7):H01L21/306 主分类号 G03F7/42
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