发明名称 |
Optoelectronic packaging assembly |
摘要 |
Optoelectronic packaging assemblies for optically and electrically interfacing an electro-optical device to an optical fiber and to external circuitry. An optoelectronic packaging assembly includes a submount for holding an optical bench with an electro-optical device. Electrically conductive pins provide electrical contact to the electro-optical device. The optoelectronic packaging assembly includes an optical input receptacle for receiving an optical ferrule and an optical fiber. The optical input receptacle assists optical coupling of the electro-optical device to the optical fiber. The optoelectronic packaging assembly provides for cooling using a heat-sink or a thermal-electric-cooler. Beneficially, the optoelectronic packaging assembly is sealed using a cover.
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申请公布号 |
US6663294(B2) |
申请公布日期 |
2003.12.16 |
申请号 |
US20010940649 |
申请日期 |
2001.08.29 |
申请人 |
SILICON BANDWIDTH, INC. |
发明人 |
CRANE, JR. STANFORD W.;HORVATH ZSOLT |
分类号 |
G02B6/38;G02B6/42;H01S5/024;(IPC1-7):G02B6/42 |
主分类号 |
G02B6/38 |
代理机构 |
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代理人 |
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地址 |
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