发明名称 MOLD-RESISTANT CORRUGATED CARDBOARD AND VOID-FORMING STRUCTURES AND PROCESS
摘要 Corrugated cardboard is disclosed that resists the growth of mold, the cardboard comprising: a single face liner containing starch, biocide, water and pulp; a double face liner containing starch, biocide, water and pulp; a fluted mediu m sandwiched between the single face and double face liners; and adhesive securing the fluted medium to the single face and double face liners. Structures are also disclosed for forming voids in concrete during construction processes where the voids resist growth of mold and spores, and a process is taught for producing mold - resistant corrugated cardboard and structures for forming voids.
申请公布号 CA2431614(A1) 申请公布日期 2003.12.12
申请号 CA20032431614 申请日期 2003.06.10
申请人 COMEAU, DOMINIC HAMEL;ROSENBLAT, MICHAEL L. 发明人 COMEAU, DOMINIC HAMEL;ROSENBLAT, MICHAEL L.
分类号 B31F1/20;B31F1/28;B32B1/00;B32B3/28;B32B27/08;D21F11/12;D21H11/00;D21H17/28;D21H21/36;D21H27/40;E02D31/10;E04B5/32;E04C3/34;E04G15/06;(IPC1-7):D21H21/36 主分类号 B31F1/20
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