POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS HAVING THE SAME

摘要

PURPOSE: A polishing pad and a CMP(Chemical Mechanical Polishing) apparatus having the same are provided to be capable of preventing the generation of surface scratch at a window for reducing the noise contained in the light reflected from a substrate. CONSTITUTION: A polishing pad(202) is provided with a window(204), the second groove(204a) formed at the center portion of the window, a plurality of circular type first grooves(202a) spaced apart from each other, and the third groove(204b) formed at the peripheral portion of the window for connecting the first grooves with the second groove. At this time, light is supplied to the surface of a substrate through the second groove. Preferably, the first, second, and third groove have the same depth with each other.