发明名称 |
Flexible routing channels among vias |
摘要 |
Flexible routing channels among vias is disclosed. A semiconductor device of one embodiment includes a number of metal layers, a number of dielectric layers, a number of via holes, and a number of routing channels. The metal layers are organized along a vertical axis. The dielectric layers are alternatively positioned relative to the metal layers. The via holes are situated within the dielectric layers and electrically connect a lower layer of the metal layers to an upper layer of the metal layers. The routing channels are situated within the metal layers and provide for electrical routing through the device along at least one of two horizontal axes of a horizontal plane perpendicular to the vertical axis.
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申请公布号 |
US2003227084(A1) |
申请公布日期 |
2003.12.11 |
申请号 |
US20020165336 |
申请日期 |
2002.06.07 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
HOU CLIFF;LU LEE-CHUNG;CHENG CHIA-LIN |
分类号 |
G06F17/50;H01L23/525;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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