发明名称 DEVICE AND METHOD FOR RUNNER-LESS MOLDING OF THERMOSETTING RESIN AND RUBBER
摘要 A method for the runner-less molding of thermosetting resin and rubber, characterized by comprising the steps of slidably disposing movable runner bushes (15) allowing, to flow therein, flow material supplied from a filling nozzle (31) maintained in non-hardened and unvulcanized low temperature state in temperature-controlled bushes (13) communicating with the gates (4) in cavities (1), separating, during heat treatment, distances between the movable runner bushes (15) and the gates (4) to form insulating space parts (A), and movably inserting valve pins (18) in the movable runner bushes (15) so that the gates (4) can be opened and closed by the valve pins (18) in connection with the fill-out operation of the flow material, whereby, since the high forming temperature of the cavities at the time of molding is prevented from conducting to runner portions by far separating the distance thereof from the gates and a uniform runner temperature distribution can be formed, the material loss of a spool runner can be eliminated, a secondary machining cost and the amount of the material scrapped as industrial waste can be reduced, a formability can be increased, and a load on the global environment can be reduced.
申请公布号 WO03101703(A1) 申请公布日期 2003.12.11
申请号 WO2002JP10234 申请日期 2002.10.01
申请人 SEIKI CORPORATION;TANAKA, YOSHIAKI;YOSHIDA, MASAAKI 发明人 TANAKA, YOSHIAKI;YOSHIDA, MASAAKI
分类号 B29C45/27;(IPC1-7):B29C45/27 主分类号 B29C45/27
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