| 摘要 |
<p>A stacked IC device formed by stacking IC chips in a plurality of stages, wherein the number of bonding wires being connected for selecting an IC chip in some stage of the stacked IC device is decreased. The IC chip selection device at each stage is connected, in chain, with the selection devices at adjacent stages to form a shift register. Only when a trigger signal is imparted to these selection devices, a signal held by itself is transmitted sequentially to the selection devices in adjacent stages.</p> |
