| 摘要 |
The invention relates to a lead-free, low-melting glass for covering a substrate. This glass contains 0.1-25 wt % of SiO2, 1-50 wt % of B2O3, 1-45 wt % of ZnO, 20-90 wt % of Bi2O3, 0.1-40 wt % of V2O5, 0-5 wt % of Nb2O5, 0-20 wt % of R2O where R is Li, Na or K, and 0-20 wt % of RO where R is Mg, Ca, Sr or Ba. This glass has a thermal expansion coefficient of from 65x10<-7>/° C. to 101x10<-7>/° C. within a range of 30-300° C.; and has a softening point of not higher than 630° C.
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