| 摘要 |
<p>A heat transfer device includes a thermal superconducting body (5), which has a hollow heat transfer body (55) and a heat transfer layer (57). The hollow heat transfer body (55) is made of a heat conductive material and has a flat top portion (52) and a flat bottom portion (51) connected to the flat top portion (52) and cooperating with the flat top portion (52) to form a sealed vacuum receiving space (56) therebetween. The heat transfer layer (57) is made of a thermal superconductor material, is disposed in the vacuum receiving space (56), and forms a superconductor lining on an inner wall surface (54) of the heat transfer body(55). <IMAGE></p> |
