| 发明名称 |
Method for improving adhesion to copper |
| 摘要 |
Poorly adherent layers such as silicon nitride and silicon dioxide exhibit improved adhesion to copper member by providing an intervening germanium-containing layer. The germanium-containing layer is copper germanide, germanium oxide, germanium bitride or combinations thereof. The germanium-containing layer enhances the adhesion such that the poorly adherent layer is less susceptible to delamination from the copper member. |
| 申请公布号 |
GB2345790(B) |
申请公布日期 |
2003.12.10 |
| 申请号 |
GB19990027378 |
申请日期 |
1999.11.22 |
| 申请人 |
* INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
VINCENT JAMES * MCGAHAY;THOMAS HENRY * IVERS;HENRY * NYE;JOYCE C * LIU;HENRY * NYE;VINCENT JAMES * MCGAHAY;THOMAS HENRY * IVERS;JOYCE C * LIU |
| 分类号 |
H01L21/3205;H01L21/28;H01L21/768;H01L23/52;H01L23/532;(IPC1-7):H01L21/768 |
主分类号 |
H01L21/3205 |
| 代理机构 |
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