发明名称 |
Microwave monolithic integrated circuit assembly with multi-orientation pyrolytic graphite heat-dissipating assembly |
摘要 |
A microwave monolithic integrated circuit assembly includes a microwave monolithic integrated circuit having an MMIC circuit plane and having a first region of relatively high heat production and a second region of relatively low heat production. A heat-dissipating assembly is in thermal contact with the microwave monolithic integrated circuit. The heat-dissipating assembly has at least two pieces of pyrolytic graphite embedded within a casing. The pieces of pyrolytic graphite include a first piece of pyrolytic graphite underlying the first region and having a high-thermal-conductivity x-direction of the first piece lying within about 20 degrees of a perpendicular to the MMIC circuit plane, and a second piece of pyrolytic graphite underlying the second region and having a high-thermal-conductivity x-direction of the second piece lying within about 20 degrees of the MMIC circuit plane. The heat-dissipating assembly is preferably fabricated by hot isostatic pressing.
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申请公布号 |
US6661317(B2) |
申请公布日期 |
2003.12.09 |
申请号 |
US20020099221 |
申请日期 |
2002.03.13 |
申请人 |
THE BOEING CO. |
发明人 |
ALI MIR AKBAR;PETERSON CARL W. |
分类号 |
H01L23/373;H01L25/16;(IPC1-7):H01P1/00;H01P3/08;H05K7/20 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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