发明名称 HELIUM FEED THROUGH
摘要 PURPOSE: A helium feed through is provided to stably supply coolant gas to a reaction chamber and improve endurance by using a heat-resistant material and by simply improving the connection structure with a connection unit. CONSTITUTION: The helium feed through is installed in a portion under the reaction chamber to supply coolant gas to the bottom surface of a wafer. A main body(410) is made of a ceramic material and has a gas flow path(430) that has a center portion of a V type whose center is bent. The outer diameter of both side ends of the main body extends further so that a connection unit(700) of an edge part(420) is connected to an extended circumferential portion by a screw(800).
申请公布号 KR20030092722(A) 申请公布日期 2003.12.06
申请号 KR20020030498 申请日期 2002.05.31
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JUNG, YONG JUN;SHIN, IL GWON
分类号 H01L21/00;(IPC1-7):H01L21/00 主分类号 H01L21/00
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