发明名称 |
HEATING ELEMENT, HEATING SUBSTRATE, METHOD OF MANUFACTURING HEATING SUBSTRATE, MICROSWITCH AND FLOW SENSOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a heating element and a substrate having good stability and durability, a method for manufacturing them, and an apparatus using them. SOLUTION: A Si substrate 1 made conductive by diffusing impurities such as boron to at least part of it is used as a material for this heating element. An etching process is applied to its heater part 2 provided with one or more slits formed by removing corner parts or by rounding them off, and it is integrated with the silicon substrate 1 to make the heating element. At the same time, a recess provided in its lower part to control the heating condition of the heater part 2 is integrally formed with the substrate. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2003347014(A) |
申请公布日期 |
2003.12.05 |
申请号 |
JP20030006017 |
申请日期 |
2003.01.14 |
申请人 |
SEIKO EPSON CORP |
发明人 |
ARAKAWA KATSUHARU;FUJII MASAHIRO;KOEDA SHUJI |
分类号 |
H05B3/14;H01H11/02;H01H29/02;H01H61/00;H01H61/01;H01H61/013;(IPC1-7):H05B3/14 |
主分类号 |
H05B3/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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