| 摘要 |
PROBLEM TO BE SOLVED: To easily prevent wafers from mutually adsorbing when a substrate is pulled up from treating liquid. SOLUTION: In a method for manufacturing a semiconductor device which pulls up a jig 1 housing a plurality of wafers 2 from the liquid of a cleaning tank 3, at least one side face of the treatment tank 3 is inclined to the outward. The jig 1 is pulled up by sliding the jig 1 along the inclined face. Respective wafers 2 are contacted with protrusions formed under the wafers 2 by their own weight, by inclining the jig at a specified angle and pulling it. The inclination and the interval of the wafers 2 are made uniform, and the alignment state of the wafers 2 is adjusted. In addition, since the wafers 2 are pulled upward, the wafers 2 are pressed to the protrusions formed under the wafers 2 by the resistance of the cleaning liquid and also the alignment state is adjusted. Consequently, it is possible to prevent the adjacent wafers 2 from adsorbing. COPYRIGHT: (C)2004,JPO |
