| 摘要 |
PROBLEM TO BE SOLVED: To increase a reliability and reduce a manufacturing cost by reducing damages due to an external bonding force and preventing the falling-off of through electrodes and the interfacial separation when stacking a plurality of semiconductor chips. SOLUTION: The semiconductor chip comprises a main body 11 of the chip formed with a desired circuit, the through electrodes 16 embedded in a plurality of through holes 12 extended through the main body 11 of the chip, and external electrodes 17 and 18 formed on both end parts of each through electrode 16. In such a semiconductor chip, the plurality of through holes 12 are formed at a constant pitchαalong the periphery of the main body 11 of the chip, with ends of each through hole 12 being shifted by an integer times (N≥1) as large as the pitchαon the front and rear faces of the main body 11 of the chip. In a stacked type semiconductor module wherein a plurality of such semiconductor chips 10 are stacked, part of the through electrodes 16 of one semiconductor chip are electrically connected to part of those of the adjacent semiconductor chips which are shifted by one pitch. COPYRIGHT: (C)2004,JPO
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