| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device using an interposer from which a substrate for maintaining strength during manufacturing is removed. <P>SOLUTION: A resin layer 3 for peeling having low adhesiveness which is easily peelable from a silicon substrate 1 is formed on a silicon substrate. An interposer 30 is formed on the resin layer for peeling, and a plurality of semiconductor elements 31 are mounted on the interposer. The semiconductor element is sealed by a sealing resin 32 to form a semiconductor device, and the semiconductor device is diced so as to be integrated into pieces from the sealing resin side with the silicon substrate 1 remaining. The semiconductor device integrated into pieces is individually peeled between the silicon substrate 1 and the resin layer 3 for peeling. The resin layer 3 for peeling is formed with an opening to expose a terminal on the interposer. <P>COPYRIGHT: (C)2004,JPO</p> |
