| 摘要 |
PROBLEM TO BE SOLVED: To prevent lowering of air-tightness for the inside of a container due to generation of raised welds at the junction surface with a cover and peeling or damage is generated at the cover in a resin insulation basic material formed by the injection molding process. SOLUTION: This semiconductor element housing package comprises an insulated basic material 1 which is formed by injection molding of a resin 13 including a fibrous filling material, through integral formation of a substrate 1b including the area 1a for placing a semiconductor element S at the center of an upper surface and a frame 1c surrounding the placing area 1a and a cover 2 mounted on the upper surface of the frame 1c covering the placing area 1a. A junction surface 3 with the cover 2 at the upper surface of the frame 1c includes a resin contact portion 4 which is formed through line contact of fluid of the resin 13 due to the injection molding and is also provided with a recess portion 5 like a groove provided along the resin contact portion 4 formed like a line. COPYRIGHT: (C)2004,JPO |
