FABRICATING METHOD FOR METALLIC FOIL ATTACHED LAMINATED BOARD WITH INNER LAYER CIRCUIT

摘要

PROBLEM TO BE SOLVED: To fabricate a metallic foil attached laminated board with an inner layer circuit in which in forming a number of the laminated boards, metallic templates with a thickness of 0.8 mm or less are arranged between each of laminating components serving as one sheet in the laminated boards to reduce the warp of the boards and further improve the inner circuit positioning accuracy. SOLUTION: A first metallic template 1 with a thickness of 0.8 mm or less are arranged between each of the laminating components serving as one sheet in the metallic foil attached laminated board with inner layer circuit. the first metallic template 1 and a second metallic template 2 with thickness of 1 mm or more are arranged in the uppermost and lowermost surfaces of a plurality of groups of the laminating components put between press heating boards 20. Besides, one or more sheets of a third metallic template 3 is or are arranged between the first metallic template 1 and the second metallic template 2. The third metallic template is the same material as the first metallic template or has an intermediate coefficient of thermal expansion between the first and the second metallic templates. COPYRIGHT: (C)2004,JPO