| 摘要 |
PROBLEM TO BE SOLVED: To improve heat dissipating efficiency without damaging mounting efficiency. SOLUTION: The heat dissipating device is formed whose whole shape is cylindrical and which is composed of a metal material having superior thermal conductivity and has an engaging hole 11 whose diameter is slightly smaller than an outer diameter of an axial lead 7 of an electronic component 5. The axial lead 7 has superior thermal conductivity and is inserted in an attaching hole 4 formed in a wiring board 2 and soldered. The heat dissipating device is engaged with an outer peripheral part of the axial lead 7, in the state of forcible contact, so that heat generated from the electronic component 5 is dissipated effectively via the axial lead 7. Since the heat dissipating device is a member which is engaged directly with the axial lead 7, the device does not occupy a large region around the electronic component 5, and mounting efficiency to the wiring board 2 is not deteriorated. COPYRIGHT: (C)2004,JPO
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