| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC chip which can prevent the occurrence of a defect in a rear face side. SOLUTION: In an IC chip wherein one surface of a substrate 12 is a face surface FF wherein a circuit is formed and the rear of the face surface is a rear face RF, defect preventive means for preventing a defect by a crack 13 are formed at four sides of the rear face RF of the substrate. COPYRIGHT: (C)2004,JPO
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