发明名称 |
Microelectromechanical device using resistive electromechanical contact |
摘要 |
A microelectromechanical device that transmits an electric signal using mechanical contact between conductors is provided. The microelectromechanical device has a conductive oxide layer on at least one of contacting surfaces of the conductors. The conductor may be a signal line or a contact pad. According to the microelectromechanical device, the signal line or the contact pad is coated with the conductive oxide layer, thereby preventing the occurrence of micro-welding problem due to resistive heat. As a result, a reliability and a power handling of a microelectromechanical device can be improved.
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申请公布号 |
US2003222321(A1) |
申请公布日期 |
2003.12.04 |
申请号 |
US20020230563 |
申请日期 |
2002.08.29 |
申请人 |
YANG WOO-SEOK;JUNG SUNG-HAE;KANG SUNG-WEON;KIM YUN-TAE |
发明人 |
YANG WOO-SEOK;JUNG SUNG-HAE;KANG SUNG-WEON;KIM YUN-TAE |
分类号 |
H01H1/20;H01H59/00;(IPC1-7):H01L21/00;H01L29/82 |
主分类号 |
H01H1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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