发明名称 ELECTRONIC COMPONENT CONVEYING CARRIER SUBSTRATE AND ELECTRONIC COMPONENT CONVEYING CARRIAGE
摘要 PROBLEM TO BE SOLVED: To obtain an electronic component conveying carrier substrate and an electronic component conveying carriage that have the excellent adherence of a cover tape to the carrier substrate and excellent antistatic properties. SOLUTION: The surface or the inner part of the electronic component conveying carrier substrate having electronic component storage parts contains at least a polyvinyl acetate resin, an ethylene copolymer, an acrylic resin, or wax. The electronic component conveying carriage comprises the electronic component conveying carrier substrate and an electronic component conveying cover tape attached to cover the upper surface of the electronic component storage parts. The electronic component conveying cover tape has an adhesive resin layer formed from a resin composition containing at least one polymer chosen between an olefin copolymer that contains in a molecule a calboxyl group or an acylocy group and a block copolymer of the compound of an ionomer resin and an aromatic vinyl and the compound of an conjugated diene compound. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003341720(A) 申请公布日期 2003.12.03
申请号 JP20020155138 申请日期 2002.05.29
申请人 NITTO DENKO CORP 发明人 ICHIKAWA HIROKI;NAKANO ICHIRO;KAKIMOTO WATARU;HANAI TAKAOMI
分类号 B65D73/02;B65D85/86;(IPC1-7):B65D73/02 主分类号 B65D73/02
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