发明名称 RESIN COMPOSITION, AND PREPREG, LAMINATED SHEET AND MULTILAYER PRINTED CIRCUIT BOARD PREPARED BY USING IT
摘要 PROBLEM TO BE SOLVED: To provide a resin composition with low permittivity and dielectric loss tangent, providing a flame-retardant cured product, and a prepreg, a laminated sheet and a multilayer printed circuit board prepared by using it. SOLUTION: The resin composition comprises a cross-liking component with a wt. average molecular wt. of 1,000 or less and having a multifunctional styrene group of formula 1 (wherein R is an optionally substituted hydrocarbon; R<SP>2</SP>, R<SP>3</SP>and R<SP>4</SP>are each a H atom or a 1-6C hydrocarbon group; R<SP>5</SP>, R<SP>6</SP>, R<SP>7</SP>and R<SP>8</SP>are each a H atom or a 1-20C hydrocarbon group; and n is an integer of 2 or more) and a bromine compound, used for preparation of the prepreg, the laminated sheet and the multilayer printed circuit board. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003342311(A) 申请公布日期 2003.12.03
申请号 JP20020154158 申请日期 2002.05.28
申请人 HITACHI LTD;HITACHI CHEM CO LTD 发明人 AMO SATORU;YAMADA SHINJI;ISHIKAWA TAKAO;TAKAHASHI AKIO;NAKAMURA YOSHIHIRO;HANAWA AKINORI;IIJIMA TOSHIYUKI
分类号 C08J5/24;B32B15/08;C08F2/44;C08F12/34;C08F291/00;C08K3/18;C08K5/03;C08K5/3417;C08L101/00;H05K1/03;(IPC1-7):C08F2/44;C08K5/341 主分类号 C08J5/24
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