| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition capable of obtaining a molding having a large dielectric constant, a small dielectric loss tangent, and a small temperature coefficient of dielectric constant in a high frequency region not smaller than 1 GHz. SOLUTION: This thermoplastic resin composition contains a thermoplastic resin selected at least either one of a styrenic polymer having syndiotactic structure or a liquid crystal polymer resin, and an inorganic filler which is a solid solution having a characteristic at sintering of a dielectric constant at 1 MHz of 18-130, an fQ value of not smaller than 2,000, and a resonance frequency temperature coefficient at -20°C-80°C of -2 to 35 ppm. COPYRIGHT: (C)2004,JPO |
