| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing that can effect high-speed filling by taking advantage of its low-temperature sealing properties and at the same time can exhibit heat resistance when subjected to high-temperature filling and boiling sterilization after filling. SOLUTION: The resin composition for sealing comprises (A) a polyethylene having a density of 0.875-0.905 g/cm<SP>3</SP>and (B) a polyethylene having a density of 0.935-0.990 g/cm<SP>3</SP>in a specified ratio. The resin composition has two or more melting points in a DSC curve obtained by measurement by a differential scanning calorimeter wherein in the case of (D) the density of the component (B) being 0.935-0.950 g/cm<SP>3</SP>, the difference between the minimum melting point (Tm:min) and the maximum melting point (Tm:max) [Tm:max-Tm:min≡ΔT] at two or more melting points in the DSC curve is not less than 20°C and in the case of (E) the density of the component (B) being more than 0.950 g/cm<SP>3</SP>to not more than 0.990 g/cm<SP>3</SP>,ΔT at two or more melting points in the DSC curve is not less than 30°C. COPYRIGHT: (C)2004,JPO
|
