摘要 |
PROBLEM TO BE SOLVED: To provide a heat-resistant resin composition which has a low organic solvent content, does not cause an environmental pollution or work environment deterioration, is advantageous in terms of safety and health, and is excellent in adhesion to an iron substrate and in heat resistance; and a coating material containing the composition as the coating film component. SOLUTION: This resin composition is prepared by compounding (A) a polyamideimide resin prepared by reacting an amine component containing 50-99.9 mol% diaminodiphenyl ether and 0.1-20 mol% diaminosiloxane with an aromatic tribasic acid anhydride in a basic polar solvent, (B) a basic compound, and (C) water. The compounding amount of the basic compound (B) is 1-20 equivalents based on the acid value of the sum of carboxyl groups contained in the polyamideimide resin (A) and carboxyl groups generated by subjecting the acid anhydride groups of the polyamideimide resin (A) to ring opening. COPYRIGHT: (C)2004,JPO
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