发明名称 HEAT-RESISTANT RESIN COMPOSITION AND COATING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a heat-resistant resin composition which has a low organic solvent content, does not cause an environmental pollution or work environment deterioration, is advantageous in terms of safety and health, and is excellent in adhesion to an iron substrate and in heat resistance; and a coating material containing the composition as the coating film component. SOLUTION: This resin composition is prepared by compounding (A) a polyamideimide resin prepared by reacting an amine component containing 50-99.9 mol% diaminodiphenyl ether and 0.1-20 mol% diaminosiloxane with an aromatic tribasic acid anhydride in a basic polar solvent, (B) a basic compound, and (C) water. The compounding amount of the basic compound (B) is 1-20 equivalents based on the acid value of the sum of carboxyl groups contained in the polyamideimide resin (A) and carboxyl groups generated by subjecting the acid anhydride groups of the polyamideimide resin (A) to ring opening. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003342469(A) 申请公布日期 2003.12.03
申请号 JP20020154032 申请日期 2002.05.28
申请人 HITACHI CHEM CO LTD 发明人 SAOTOME TAKEHIKO
分类号 C08L79/08;C08G73/14;C08K3/20;C08K5/17;C09D179/08;(IPC1-7):C08L79/08 主分类号 C08L79/08
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