发明名称 SLURRY REGENERATING METHOD
摘要 PROBLEM TO BE SOLVED: To improve the collection ratio of a dispersion medium. SOLUTION: A slurry regenerating method includes a step of separating a used slurry further containing silicon chips generated when slicing a silicon ingot under the presence of the slurry consisting of abrasive grains and a dispersion medium to disperse the abrasive grains into a dispersion solution mainly containing abrasive grains and a dispersion solution mainly containing silicon chips, a step of collecting the dispersion medium by (1) performing centrifugal separation of the dispersion medium mainly containing silicon chips by a centrifugal force of≥5,000 G, (2) performing centrifugal separation by a low centrifugal force, and further performing centrifugal separation by a high centrifugal force, and (3) performing centrifugal separation or (4) distillation, and a step of regenerating the slurry by utilizing the abrasive grains, the dispersion medium mainly containing abrasive grains and the collected dispersion medium. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003340719(A) 申请公布日期 2003.12.02
申请号 JP20020151208 申请日期 2002.05.24
申请人 SHARP CORP 发明人 KAJIMOTO KIMIHIKO
分类号 B01D3/00;B24B57/02;B28D5/04;C02F11/00;C02F11/12;(IPC1-7):B24B57/02 主分类号 B01D3/00
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