发明名称 |
SOLDER COMPOSITIONS FOR ATTACHING A DIE TO A SUBSTRATE |
摘要 |
A method for attaching a die (11) to a substrate (15) is provided. In accordance with the method, a die and a substrate are provided which are to be connected to each other across first and second surfaces. The first and second surfaces are contacted with a liquid solder composition (21) having a maximum melting temperature Tm1, of less than about 100 C. The liquid solder composition is contacted with a freezing agent (17 or 19) such that a second composition is formed which has a maximum melting temperature Tm2, wherein T2-Tm1 is at least about 25° C. |
申请公布号 |
AU2003225119(A1) |
申请公布日期 |
2003.12.02 |
申请号 |
AU20030225119 |
申请日期 |
2003.04.23 |
申请人 |
MOTOROLA, INC. |
发明人 |
FLOYD STROUSE;LORI, D. CARROLL-SHEARER;BRANT BESSER |
分类号 |
B23K35/00;B23K35/26;H01L21/60 |
主分类号 |
B23K35/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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