| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photoreactive resin composition which has high sensitivity and is hard to cause gelation, and a method for manufacturing a circuit board and a multilayer board which have a high resolving degree wiring pattern and a via hole by the photolithography using the same. <P>SOLUTION: The photoreactive resin composition comprises a polyvalent metal powder and/or an inorganic powder containing a polyvalent metal oxide powder, a first alkali-soluble polymer having an ethylenically unsaturated double bond, a monomer having an ethylenically unsaturated double bond, a photoreaction initiator, an organic solvent, and a second polymer having a pyrrolidone ring in the side chain. <P>COPYRIGHT: (C)2004,JPO |
