| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To achieve cost reduction by shortening a time taken to occupy a fixture for pressurization, heat and positioning. <P>SOLUTION: Between a semiconductor element 1 and a wiring substrate 7, sealing resin 3 is supplied which is blended with a thermoplastic ingredient and a thermosetting ingredient and is heated with a temperature not lower than that of a melting point of the thermoplastic ingredient. Next, the sealing resin 3 is pushed and extended by pressurization between the semiconductor element 1 and the wiring substrate 7, which are then bonded with the semiconductor element 1 by welding by cooling and contracting the thermoplastic ingredient. Then, the thermosetting ingredient is cured by heating with a temperature not higher than that of the welding and bonding of the thermoplastic ingredient. <P>COPYRIGHT: (C)2004,JPO</p> |
