发明名称 MODULE DE CIRCUIT INTEGRE SUR FILM ET SON PROCEDE DE FABRICATION
摘要 The invention concerns the manufacturing of an integrated circuit module (42) for a smart portable object (1) such as a smart card, an electronic label or the like. After fixing an integrated circuit (2) on a first surface of a film (18a), the integrated circuit having at least an electric contact (8) facing said surface (18a), it consists in: perforating the film (18) opposite each contact to be connected, from the second surface (18b) of the film and optical guiding means such as for example computer-assisted visual display means; the perforating means comprising a laser.
申请公布号 FR2816107(B1) 申请公布日期 2003.11.28
申请号 FR20000013940 申请日期 2000.10.30
申请人 GEMPLUS 发明人 DOSSETO LUCILE
分类号 G06K19/077;H01L21/60;H01L23/498;H01L23/538 主分类号 G06K19/077
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