发明名称 |
METHOD FOR FABRICATING PCB AND PCB FABRICATED THEREBY |
摘要 |
PURPOSE: A method for fabricating a PCB(Printed Circuit Board) and a PCB fabricated thereby are provided to remove a dummy line and enhance the efficiency by performing a patterning process on a mandrel. CONSTITUTION: A metallic material is plated on a mandrel of a substrate(5) on which patterns are formed. A metallic conductive line(3) is formed by plating the metallic material on the mandrel. A metal layer or a polymer layer is formed or the metal layer and the polymer layer sequentially formed on the substrate(5) in order to enhance the adhesive strength. The polymer is coated on the metallic conductive line(3). A dry process is performed to dry the polymer. The mandrel is removed. The mandrel is formed with one of stainless steel, aluminium, and nickel.
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申请公布号 |
KR20030090383(A) |
申请公布日期 |
2003.11.28 |
申请号 |
KR20020028666 |
申请日期 |
2002.05.23 |
申请人 |
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY |
发明人 |
KIM, YEONG HO;LEE, HYEOK JAE;YOO, JIN |
分类号 |
H05K3/38;(IPC1-7):H05K3/38 |
主分类号 |
H05K3/38 |
代理机构 |
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代理人 |
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地址 |
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