发明名称 |
MOLDED CASE DRY CAPACITOR |
摘要 |
PROBLEM TO BE SOLVED: To solve the problem that in a molded case dry capacitor, its capacitor element and its terminals become so stressed by its internal heat evolution and due to the temperature change in the environment as to reduce its reliability, and to solve the problem that cracks occur in its filled resin stressed under low and high temperatures. SOLUTION: The molded case dry capacitor has a filled resin. The cooling- heating-impact resistance and its moisture resistance of the capacitor are improved by the characteristic of the filled resin which is made not smaller than 120 MPa in bending strength and is made not larger than 7,000 MPa in bending elastic modulus. COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2003338421(A) |
申请公布日期 |
2003.11.28 |
申请号 |
JP20020147410 |
申请日期 |
2002.05.22 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
TOMITA MAKOTO;OKUNO SHIGEO |
分类号 |
H01G4/224;B60L9/18;H01G4/18;(IPC1-7):H01G4/18 |
主分类号 |
H01G4/224 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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