发明名称 |
Depositing a copper film on a substrate, especially an integrated circuit, by chemical vapor deposition comprises using a copper precursor composition comprising copper(I) chloride or bromide and a selected organic solvent |
摘要 |
Depositing a copper film on a substrate by contacting the heated substrate with a copper precursor in the vapor phase comprises using a copper precursor composition comprising copper(I) chloride or bromide and a selected organic solvent. Depositing a copper film on a substrate by contacting the heated substrate with a copper precursor composition in the vapor phase, optionally in the presence of hydrogen comprises using a copper precursor composition comprising copper(I) chloride or bromide and a nonaromatic, nonplanar, heteroatom-free organic solvent with at least two nonconjugated unsaturations selected from: (a) noncyclic compounds optionally substituted with alkyl groups on unsaturated carbons; (b) alkyl-substituted diunsaturated cyclic compounds; (c) monounsaturated cyclic compounds with unsaturated substituents; and (d) cyclic compounds with a diunsaturated substituent or two monounsaturated substituents.
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申请公布号 |
FR2839982(A1) |
申请公布日期 |
2003.11.28 |
申请号 |
FR20020006228 |
申请日期 |
2002.05.22 |
申请人 |
CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE CNRS |
发明人 |
DOPPELT PASCAL |
分类号 |
C23C16/18;H01L21/285;(IPC1-7):C23C16/08;C01G3/04 |
主分类号 |
C23C16/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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