| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device and a wire bonding apparatus in which no breaking of wire occurs. <P>SOLUTION: The semiconductor device is provided with a semiconductor chip 5 including a plurality of electrodes 6 arranged along one side thereof, a plurality of lead pins 4 that are arranged in one side of the semiconductor chip with a gap to one another and is also each arranged corresponding to the plurality of the electrodes 6, and wires 7 for connecting electrically each of the plurality of electrodes 6 and each of the plurality of the lead pins 4 by means of bonding using capillaries. With regard to every wire 7, an angle between the extending direction of the wires 7 and the normal line of one side of the semiconductor chip 5 is such an angle (30 or less) that shapes of stitches 7b in connecting portions of the wires 7 and lead pins 4 become axisymmetrical relatively to the extending direction of the wires. <P>COPYRIGHT: (C)2004,JPO |
