| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable mounting structure of a high frequency module which does not cause the peel of a soldered portion. SOLUTION: In the mounting structure of a high frequency module, a land 13 where an electrode 3 and a reinforcing electrode 6 provided at the lower surface of a circuit board 1 are provided on a mother board 11 is soldered to a reinforcing land 14. Moreover, the lower surface of the circuit board 1 is bonded to the mother board 11 with a thermosetting bonding agent 10. Accordingly, the high frequency module M1 can be mounted strictly to the mother board 11 with soldering between the reinforcing electrode 6 and the reinforcing land 14, and with the bonding agent 10. The peel of the soldered portion can be prevented and thereby the highly reliable mounting structure of the high frequency module can be provided. COPYRIGHT: (C)2004,JPO
|
