发明名称 Polishing pad
摘要 A polishing pad is described as comprising, (a) particulate polymer which can be chosen from particulate thermoplastic polymer (e.g., particulate thermoplastic polyurethane), particulate crosslinked polymer (e.g., particulate crosslinked polyurethane and/or particulate crosslinked polyepoxide) and mixtures thereof; and (b) organic polymer binder (e.g., polyurethane binder and/or polyepoxide binder), which can bind the particulate polymer together, wherein said organic polymer binder can be prepared in-situ. The particulate polymer and organic polymer binder can be distributed substantially across the work surface the polishing pad, and the pad can have a percent pore volume of from 2 percent by volume to 50 percent by volume, based on the total volume of said polishing pad.
申请公布号 US2003217517(A1) 申请公布日期 2003.11.27
申请号 US20020317982 申请日期 2002.12.13
申请人 ALLISON WILLIAM C.;SWISHER ROBERT G.;WANG ALAN E. 发明人 ALLISON WILLIAM C.;SWISHER ROBERT G.;WANG ALAN E.
分类号 B24B37/00;B24B37/04;B24D3/28;B24D3/32;B24D11/00;B24D13/14;B24D99/00;C08J5/14;C08L101/00;C09K3/14;H01L21/304;(IPC1-7):B24D11/00;B24D3/00;B24D18/00 主分类号 B24B37/00
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