发明名称 Bonding apparatus
摘要 A bonding apparatus including: a horn holder pivotably connected at a first connecting portion to a bonding head, an ultrasonic horn having a capillary and held in the horn holder, a linking arm pivotably connected at a second connecting portion to the horn holder and pivotably connected at a third connecting portion to the bonding head, and a driving motor that moves the first connecting portion horizontally or causes the third connecting portion to pivot; and a relationship L1=L2=L3 being established, in which L1 is a distance between the third connecting portion and the second connecting portion, L2 is a distance between the second connecting portion and the tip end of the capillary, and L3 is a distance between the second connecting portion and the first connecting portion.
申请公布号 US2003218048(A1) 申请公布日期 2003.11.27
申请号 US20030444368 申请日期 2003.05.23
申请人 KABUSHIKI KAISHA SHINKAWA 发明人 MAEDA TOORU
分类号 H01L21/60;B23K20/00;B23K20/10;(IPC1-7):B23K1/06 主分类号 H01L21/60
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