发明名称 NON-FOAMED POLISHING PAD AND POLISHING METHOD THEREWITH
摘要 <p>A polishing pad made of a non-foamed material has surface roughness Ra in the range of 0.1-10 micrometers, or preferably 0.5-1.5 micrometers and variations in thickness less than 50 micrometers, or preferably less than 30 micrometers. Its shore D hardness is greater than 60 degrees, or preferably 68 degrees. Its compressibility is less than 3%, or preferably less than 1% and its elasticity is greater than 30%, or preferably 50%, as measured by specified methods. Grooves may be formed over 30%-70%, preferably 40%-60% of the total area of the polishing surface. When the polishing surface is subjected to a dressing process, its surface roughness Ra is restored to 0.1-10 micrometers, or preferably 0.5-1.5 micrometers.</p>
申请公布号 WO2003097298(P1) 申请公布日期 2003.11.27
申请号 JP2003005007 申请日期 2003.04.18
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