| 摘要 |
A test structure for testing a thick film thermoelectric device is presented. The test structure is able to test the thermoelectric device in the device's three modes of operation, namely as a cooling device, as a heat pump, and as a power generator. The test structure includes a pair of current electrode blocks for supporting and supplying power from a power supply to the thick film thermoelectric device being tested. Thermocouples are attached to different portions of the thick film thermoelectric device to indicate the temperature change across the device as it is being tested. Additionally, a heat source is provided when the device is being tested in an electrical generation mode. The test structure is able to compensate for the expansion and contraction of the thick film thermoelectric device during the testing. By way of the disclosed test structure, the thick film thermoelectric devices can be tested and characterized.
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