摘要 |
The device connects the connections (7,8) of a heat source (2) with circulation pump (27') and overflow valve (52). Two heat sinks are connected via the valve (20). A compensation path (55) is provided parallel to the second heat sink (22), and there is a further overflow valve (53) parallel to the first heat sink (21). There is also a pressure limitation valve parallel to the second heat sink, with the overflow valve parallel to the first heat sink. Mixer valve, compensation path, and additional overflow valve are combined in a modular unit (9). A heat exchanger (50) in the second heat sink contains a circulation pump (28').
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