发明名称 SNAP ELECTRODE, ITS BONDING METHOD AND USING METHOD
摘要 <p>An electrode for high density connection for connecting/disconnecting a package or an FPC. The snap electrode (11) has a tubular ring (11a) having circular or polygonal cross-section, and at least one spring electrode (11b) being fitted in and connected with the ring, characterized in that the snap electrode can be connected with a substrate or the FPC by clipping a pin electrode (13) in an insertion mounting package or FPC with the spring electrode (11b). The snap electrode (11) is preferably made of nickel or a nickel alloy, or copper or a copper alloy and preferably coated with a noble metal or conductive diamond-like carbon.</p>
申请公布号 WO03098753(A1) 申请公布日期 2003.11.27
申请号 WO2003JP04371 申请日期 2003.04.04
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD.;HAGA, TSUYOSHI 发明人 HAGA, TSUYOSHI
分类号 H01R13/03;H01R13/05;H01R13/115;(IPC1-7):H01R33/76 主分类号 H01R13/03
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