发明名称 |
SNAP ELECTRODE, ITS BONDING METHOD AND USING METHOD |
摘要 |
<p>An electrode for high density connection for connecting/disconnecting a package or an FPC. The snap electrode (11) has a tubular ring (11a) having circular or polygonal cross-section, and at least one spring electrode (11b) being fitted in and connected with the ring, characterized in that the snap electrode can be connected with a substrate or the FPC by clipping a pin electrode (13) in an insertion mounting package or FPC with the spring electrode (11b). The snap electrode (11) is preferably made of nickel or a nickel alloy, or copper or a copper alloy and preferably coated with a noble metal or conductive diamond-like carbon.</p> |
申请公布号 |
WO03098753(A1) |
申请公布日期 |
2003.11.27 |
申请号 |
WO2003JP04371 |
申请日期 |
2003.04.04 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD.;HAGA, TSUYOSHI |
发明人 |
HAGA, TSUYOSHI |
分类号 |
H01R13/03;H01R13/05;H01R13/115;(IPC1-7):H01R33/76 |
主分类号 |
H01R13/03 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|