发明名称 Heat sinks
摘要 A heat sink (100) includes a cooling block (105) having a plurality of fins (110) extending through the block to provide a series of coolant channels (112) extending between the fins, the channels having in the interior of the block a venturi narrowing. Beneficially, the channels have coolant entry regions in at least two different regions (115, 120) of the block to direct a plurality of coolant flows into the interior of the block from different directions. <??>Also described is a method of cooling a device such as a processor of a mobile computer used in a vehicle by placing the heat sink or more than one of the heat sinks adjacent to the device to be cooled, preferably with a region in which the venturi narrowing of the coolant channels is provided close to the hottest part of the device to be cooled. <IMAGE>
申请公布号 GB0324560(D0) 申请公布日期 2003.11.26
申请号 GB20030024560 申请日期 2003.10.22
申请人 MOTOROLA INC 发明人
分类号 H01L23/467 主分类号 H01L23/467
代理机构 代理人
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