摘要 |
<p>The present invention relates to compositions useful as adhesion promoters for use in adhesive formulations to enhance the adhesion of cured adhesive formulations to surfaces on which the adhesive formulations are applied. More specifically, these adhesion promoter compositions are useful with or in (meth)acrylate-based adhesives, particularly in connection with (meth)acrylate-based adhesives that may be cured by exposure to radiation in the electromagnetic spectrum, and particularly for those destined for application in bonding polar plastics, such as polycarbonate or acrylic, notably in the manufacture of optical or video disk assemblies, medical devices such as needles, and electronic devices.</p> |