| 摘要 |
A semiconductor module includes a MOSFET chip and a package for accommodating the MOSFET chip. The drain area of the MOSFET chip is connected to a base substrate. A source and a gate electrode are arranged on the top of the package, and also a drain electrode to be connected to the base substrate is arranged. On a printed-circuit board, to which a protection circuit is implemented, holes corresponding to the drain electrode, the source electrode, and the gate electrode are formed. The protection circuit is attached to the semiconductor module while the electrodes penetrate into the respective holes. <IMAGE> |
