发明名称 Evaporator of CPL cooling apparatus having fine wick structure
摘要 An evaporator of a capillary pumped loop (CPL) cooling apparatus having a fine wick structure is provided. The evaporator having a flat board shape, of a capillary pumped loop (CPL) cooling apparatus includes a coolant storing part for storing in-flowing coolant from the condenser and collecting a uncondensed gas contained in the in-flowing coolant in an upper space, a cooling part for cooling the heating body through vaporization of the coolant, and superstructure and substructure combined with each other, for defining a channel region in which the coolant flows from the coolant storing part to the cooling part by a capillary action. In this case, the substructure includes a first substructure used as a substrate and a second substructure formed along a border of the substrate, or includes first through third segments equal to the first and second substructures. The channel region is formed between the second segment and the superstructure, and a pumping means formed of patterns that are formed so that the capillary action is generated in the coolant, or a porous material is included in the channel region.
申请公布号 US6651735(B2) 申请公布日期 2003.11.25
申请号 US20020144722 申请日期 2002.05.15
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHO HYE-JUNG;LEE YONG-SOO;HONG SEOG-WOO;SONG IN-SEOB
分类号 F25B39/02;F28D15/02;H01L23/427;(IPC1-7):F28D15/00 主分类号 F25B39/02
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