发明名称 LASER BEAM MACHINING METHOD FOR THIN FILM AND DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To execute laser beam machining with excellent quality stability of a thin film supported by a cylindrical roll and to provide a laser beam machining method with high accuracy and high productivity, and its device. <P>SOLUTION: The laser beam machining device of the thin film is so constituted that a roll shaped flexible lengthy substrate 1 is conveyed to a prescribed substrate support part and the thin film formed on at least one main face of the substrate is machined by irradiation of a laser beam. The laser beam machining device is provided with a substrate conveying means to send out the substrate 1 to the outer peripheral part of a translucent hollow roll 4 as the substrate support part, to position it in a state that a tension is applied to the substrate, and to wind the substrate after machining, and a laser beam irradiating means 40 to machine the thin film by irradiation of the laser beam from the hollow side of the translucent hollow roll 4 to the thin film. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2003334673(A) 申请公布日期 2003.11.25
申请号 JP20020142767 申请日期 2002.05.17
申请人 FUJI ELECTRIC CO LTD 发明人 YOKOYAMA YASUHIRO
分类号 G02B26/10;B23K26/00;B23K26/04;B23K26/08;B23K101/42;(IPC1-7):B23K26/00 主分类号 G02B26/10
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